The utility model discloses a packaging carrier tape, in particular to a chip packaging carrier tape, which is widely used in the tape winding automatic bonding technology of the current integrated circuit device. The utility model comprises a JP formable polyimide film, and the sides in the two length directions of the JP formable polyimide film are in a wave shape with the same height. The purpose is to provide a chip packaging carrier tape which can avoid excessive friction between the chip packaging carrier belt and the conveying device or the chip packaging carrier tapet itself