Packaging carrier, especially chip packaging carrier tape background technology

In recent years, electronic products have the trend of ultra short, small, light, thin and multifunctional. Therefore, the integrated circuit device in electronic products must also meet the requirements of small size and high pin number.

In order to meet the above requirements, at present, the packaging technology of integrated circuit devices often adopts tape automatic bonding technology. The so-called tape winding automatic bonding technology, in short, connects a chip with a metal circuit arranged on the chip package carrier tape (called internal pin bonding).

The chip packaging carrier tape is usually similar to film tape in appearance, and its material is mainly polyimide, while the metal circuit on it is mainly copper.

Compared with the traditional wire bonding technology, the advantages of tape winding automatic bonding technology are that it can reduce the metal pad spacing on the integrated circuit chip, improve the density of circuit contacts, and reduce the overall volume after packaging.—chip packaging carrier tape background technology