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Tape winding automatic bonding technology – chip packaging carrier tape

The tape winding automatic bonding technology uses a conveying device to transport the chip packaging carrier belt to a specific position of the machine for packaging—chip packaging carrier tape

 

 

Join with the chip and perform sealing procedures, and roll it into a chip packaging tape roll when each procedure is completed.

 

 

The specific work flow is as follows: the chip packaging carrier belt is pulled by a conveying device from a feeding area into a working area, which is connected with the chip in the working area, and then wound to form a chip packaging carrier belt coil. However, in the process of conveying, the chip packaging carrier belt will contact and rub with a surface of the transmission track of the conveying device.—chip packaging carrier tape

 

During the above friction process, the charge will continue to be generated and accumulated, resulting in static electricity on the carrier surface of the chip package. Excessive friction will generate a large amount of static charge on the chip package carrier and cause high-density electrostatic discharge (ESD).

 

 

Electrostatic discharge usually produces enough energy to destroy the internal circuit of the chip, that is, electrostatic damage to the chip, resulting in unexpected changes in its electrical properties and seriously affecting the product quality.—chip packaging carrier tape