The TCP component consists of the device interconnected to 3 layer (carrier film, adhesive, and metal) Tape Automated Bonding (TAB) tape. The tape carrier film is polyimide and an advanced epoxy-based adhesive system is used. The interconnects are copper.–embossed carrier tape and cover tape

The tape metallization, including the Outer Lead Bond (OLB) area of the interconnections, is gold plated over a nickel flash. The silicon chip and Inner Lead Bond (ILB) area is encapsulated with a high temperature thermoset polymer coating. The backside of the chip is left uncoated for thermal connection to the
printed circuit board (PCB).embossed carrier tape and cover tape

While lower lead count TAB devices are often shipped in tape and reel
format, Intel has chosen to ship components as individual devices. The individual units are shipped in high temperature plastic slide carriers packed in coin stack tubes.embossed carrier tape and cover tape