The following orientation rules shall be considered as standard for multi-connection
components and should be followed, sequentially, until no other variation is possible.—standard rules of carrier tape

Note that these rules were originally published as EIA Guideline 783.
(a) Traditionally packaged components with leaded, bottom-only terminations (e.g.,
PLCC, SOIC, SOJ, BGA, etc.) shall be packaged with the terminations facing the bottom—standard rules of carrier tape
of the carrier cavity. Bare die shall have its terminations face upward toward the cover tape.
(b) The following rules apply
whether the terminations are facing
downward or upward in the cavity.
Termination is the electrical
connection from the component to the
board and can be described further as
lead, pin, bump, ball, pad, wirepad, or
connector.