Users may encounter the problem of assembly stacking due to slow feeding, which is caused by the electrostatic effect (attraction and repulsion) caused by the peeling of embossed carrier tape and cover tape during feeding processing This phenomenon may cause the device to move or move away from the point that the user can see, resulting in MIS pick or non pick during placement In order to minimize this effect, the control of packaging materials, sealing equipment, environment and conditions is achieved—embossed carrier tape

Optimization can effectively disperse the accumulated charge This charge, called tribo charge, can be controlled by guideline eia-541