The chip packaging carrier tape is applied in the winding type automatic bonding technology of integrated circuit device.
Because the two sides are in the wave shape with the same height, one surface of the transmission track of the conveying device changes from surface contact to point contact in the prior art, which reduces the mutual friction between the two, so as to reduce a large amount of static charge generated by excessive friction, Prevent electrostatic damage to the chip and stabilize the electrical properties of the chip—Chip packaging carrier tape