The tape winding automatic bonding technology uses a conveying device to transport the chip packaging carrier tape to a specific position of the machine for packaging
Join with the chip and perform sealing procedures, and roll it into a chip packaging tape roll when each procedure is completed. The specific work flow is as follows:–carrier tape packaging
The chip packaging carrier tape is pulled by a conveying device from a feeding area into a working area, and is connected with the core in the working area
After the chip is joined, it is wound to form a chip packaging tape roll. However, in the process of conveying, the chip packaging carrier tape will contact and rub with a surface of the transmission track of the conveying device.—carrier tape packaging
During the above friction process, the charge will continue to be generated and accumulated, resulting in static electricity on the carrier surface of the chip package. Excessive friction will generate a large amount of static charge on the chip package carriertape and cause high-density electrostatic discharge (ESD).—carrier tape packaging
Electrostatic discharge usually produces enough energy to destroy the internal circuit of the chip, that is, electrostatic damage to the chip, resulting in unexpected changes in its electrical properties and seriously affecting the product quality.