In recent years, electronic products have the trend of ultra short, small, light, thin and multifunctional. —carrier tape
Therefore, the integrated circuit device in electronic products must also meet the requirements of small size and high pin number.
In order to meet the above requirements, at present, the packaging technology of integrated circuit devices often adopts tape automatic bonding technology. —carrier tape

The so-called coiling automatic bonding technology, in short, A chip is connected with a metal circuit (called internal pin bonding) arranged on the chip package carrier tape, and the chip package carrier tape is usually similar to the film film tape, which is made of polyimide Compared with the traditional wire bonding technology, the advantage of tape winding automatic bonding technology is that it can reduce the spacing of metal pads on integrated circuit chips Improve the density of circuit contacts and reduce the overall volume after packaging—carrier tape