Generally, chip components are used for surface mount technology.

This component has small size, light weight, high installation density, and the appearance realizes standardization, serialization and consistency of welding conditions. Under the operation of high-speed chip mounter, the automation of surface mount is realized, and the production efficiency is greatly improved. At present, almost all printed circuit boards adopt this technology.

Driven by this technology, in order to realize the automatic production of components, thin carrier tape came into being.