1. SMT(surface assembly technology) features: 1.1 high assembly density, small volume and light weight of electronic products. The volume and weight of patch components are only about 1 / 10 of that of traditional plug-in components. Generally, after SMT is adopted, the volume and weight of electronic products are reduced by 40% ~ 60% and 60% ~ 80%.
2. 1.2) high reliability and strong anti vibration ability. Low solder joint defect rate.
3. 1.3 good high frequency characteristics. Reduce electromagnetic and RF interference.
4. 1.4 it is easy to realize automation and improve production efficiency.
5. 1.5 reduce the cost by 30% ~ 50%. Save materials, energy, equipment, manpower, time, etc.