FPT refers to SMD with pin spacing between 0.635-0.3mm and long × Width ≤ 1.6mm × 0.8mm SMC assembly technology on PCB.
Due to the multifunction and miniaturization of electronic products, the integration of semiconductor integrated circuits is getting higher and higher, SMC is getting smaller and smaller, and the pin spacing of SMD is becoming narrower and narrower. At present, QFP with pin spacing of 0.635mm and 0.5mm has become a general device in industrial and military electronic equipment.
The miniaturization of components promotes the continuous development and improvement of SMT’s narrow spacing Technology (FPT).
(1) BGA and CSP have been widely used and the process is relatively mature.
(2) 0201(0.6 × 0.3mm) has been widely used in multifunctional mobile phones, CCD cameras, laptops and other products.
(4) Flip chip technology has been applied in IBM in the United States and Sony in Japan
(5) MCM multi chip module – since SMC / SMD can no longer be smaller, MCM functional components are the direction of further miniaturization.