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Manufacturing process of PC carrier tape

—The raw material is PC material, which is extruded by the extrusion head with a certain width and thickness by heating and melting, and then formed by the molding blister mold before it is completely cooled, and then cut and wound—carrier tape

In the whole process, conventional molding is the key process to determine the size of the final pocket. It is a plastic suction process. The mold is a prototype and is in a rotating state when working.–carrier tape

 

Then the shape of the final product is processed on its circumference. When the PC material is softened into a colloidal shape by heating, the PC enters the cavity for molding by vacuum plastic suction. After molding, the cooling hardness of the PC material is strengthened, and the formed pocket will not change any more—carrier tape