In carrier tape market, PC carrier tape also is Widely used

– the raw material PC is extruded by the extrusion head with a certain width and thickness through heating and melting, and then formed through the forming Blister die before complete cooling, and then cut and wound In the whole process, custom molding is the key process to determine the final pocket size.

It is a blister process. The mold is a prototype, which is in a rotating state during operation, and then the shape of the final product is processed on its circumference. When the PC material is softened into colloid by heating, the PC enters the cavity for molding by means of true air blister. After molding, the cooling hardness of the PC material is strengthened, Molded pockets will no longer be changed more