The Carrier packaging industry is developing towards high-density integration, smaller and high-precision

®

At present, the global shortage of vehicle chips has not been alleviated. Malaysia, an important packaging(Carrier Tape) manufacture town deeply attacked by the epidemic, must provide a way to reduce the shortage of vehicle chips in order to effectively solve this problem

Receiving novel coronavirus pneumonia, the development of the home economy and the emerging applications driven by 5G, intelligence and new energy have led to the growth of the chip market, which has led to continuous growth in the semiconductor market demand and the shortage of goods continues.

As the advanced node moves towards smaller size, the physical problems of the chip are becoming more and more difficult to overcome, and the semiconductor industry components have entered the post Moore era. The advanced packaging technology can realize the high-density integration and miniaturization of the chip without requiring to improve the chip process, and can effectively reduce the cost and load. The high-end chip is evolving towards smaller size, higher performance and lower power consumption, Therefore, it is inevitable to become a post Moorish era

China’s semiconductor industry has developed greatly this year. With the attention of the domestic IC and semiconductor industry, the packaging industry is heading for the direction of system integration, high-speed and high frequency. The advanced technology requirements and the market share of the chip industry chain are expected to be improved.