The semiconductor industry can be divided into wafer manufacturing and packaging testing, and the corresponding material field can be divided into manufacturing materials and packaging testing materials.

With the continuous expansion of the scale of the semiconductor packaging material market, the demand for semiconductor products in many fields will increase, and the semiconductor market is closely connected with the prosperity of the industry,

The downstream market demand drives the continuous growth of equipment scale. In the future, with the steady growth of downstream 5g communication, computer, artificial intelligence, consumer electronics, network communication and other industries

With the rapid development of the Internet of things, automotive electronics, smart phones and other emerging fields, the integrated circuit industry is facing the demand for capacity expansion of new chips or advanced packaging processes,

Bring a broad market space for the semiconductor special equipment industry, and then increase the demand for semiconductor packaging materials and promote the expansion of the market.

Packaging materials have become the key to the sustainable growth of the above scientific and technological applications to support the advanced packaging technology and make a new generation of chips with high performance, integration and reliability.

China’s packaging and testing links are competitive and drive the growth of local demand. Packaging and testing is an industry with a high level of industrialization in China’s semiconductor industry chain

The expansion of chip design and wafer foundry will drive the local demand for packaging and testing.

Under the condition of tight production capacity, domestic packaging and testing manufacturers have recently released plans to expand production capacity, and the scale is expected to be further expanded