With the development of wafer level packaging and plastic packaging components, the demand for smaller, thinner and more precise components is increasing,

As a downstream process in the semiconductor industry chain for a long time, compared with wafer design and wafer manufacturing,

Packaging technology is often regarded as the least technical process in the semiconductor industry chain.

At the same time, with the outbreak of the epidemic and the development of chip technology following Moore’s law in recent decades

People are used to reducing the chip process to achieve more advanced performance, so that the packaging industry is gradually paid attention to.

With the development of science and technology, the promotion and application of intelligent driving, intelligent household appliances, AI, artificial intelligence, 5g and other fields are accelerated,

We are required to provide a series of standardized and customized cover tapes and carrier tapes to store and transport smaller and more precise chips, and meet the requirements for component protection.

The cover and carrier belt are of great use. As long as there are integrated circuits and electronic components, there will be carrier belts. It is indispensable for resistors and chips

Electronic components must be protected from damage or pollution during transportation. At this time, it is necessary to pack the electronic components with carrier tape for protection