Semiconductor industry is one of the fastest growing industries at present, with a wide range of applications, which can be seen in aerospace, aviation, medical treatment, automobile, electronics and other fields.

Semiconductor packaging plays an important role in the development of semiconductor industry. Post packaging test is to test the performance of packaged chips to ensure the quality and performance of devices after packaging.

Thin carrier tape is a technology intensive product with high competitive barriers, which is closely related to the packaging, transportation, preservation and use of electronic components,

Therefore, the performance of its products directly affects the quality of terminal electronic products and plays an important role.

For downstream electronic component manufacturers, the quality, stability and consistency of thin carrier tape are very important,

This not only affects the accuracy of surface mounting of electronic components, but also one of the important factors determining the production efficiency.

With the semiconductor technology slowly moving towards the limit, the integrated circuit industry also began to enter the post Moore’s law

Packaging technology has also moved from traditional packaging to advanced packaging, so as to further realize the integration needs of functionalization, lightness and miniaturization of downstream consumer electronic products.