WLCSP (wafer level chip scale packaging) is a wafer level chip packaging method, which is different from the traditional chip packaging method,

The traditional packaging is to cut first and then seal and test, resulting in an increase of at least 20% of the volume of the original chip after packaging, while the latest technology of WLCSP is to package and test on a complete

wafer first,

Then it is cut into separate IC particles, so the volume after packaging is equal to the original size of IC bare crystal.

The characteristics and advantages of WLCSP: the smallest size of the original chip, packaging mode, short data transmission path and high stability; Good heat dissipation characteristics.

WLCSP is applied in electronic products. At present, it has been applied in electronic watches, mobile phones, memory cards, Car Navigator, digital and other devices,

In the next few years, more WLCSP chip technologies will be adopted in the high-performance mobile market such as mobile phones.

With the gradual development of electronic parts towards miniaturization, our company is a company to create high-precision carrier tape and packaging materials, which can provide suitable packaging methods and products