With the continuous development of chips in the direction of miniaturization, the technical difficulty and cost have increased one after another, and semiconductor components have many packaging forms,

According to the appearance and size of the package, it can be divided into pin insertion type, surface mount type and advanced package. Changes in technical indicators have improved from generation to generation,

The performance of semiconductor devices is greatly improved; Chip level packaging, system packaging, etc. is to minimize the packaging area, so it also has higher and higher requirements for heat dissipation and reliability of packaging materials.

Nevertheless, new end market applications such as 5g, Internet of things, artificial intelligence and new energy electric vehicles are completely changing the semiconductor industry, and the size of chips is shrinking,

As the number of pins increases, the integration continues to improve, and there are different process flows for different component packaging, and relevant tests need to be carried out during and after packaging to ensure the quality of products.

As the semiconductor manufacturing process becomes more and more difficult, the importance of advanced packaging to continuously improve the chip performance is becoming increasingly prominent, and more requirements will be brought to the semiconductor packaging  materials