The semiconductor industry mainly includes three parts: design, manufacturing and packaging testing. As the last link of the semiconductor industry chain,

Packaging is to protect the manufactured semiconductor chip, test the reliability and stability of the chip, and finally commercialize the semiconductor product.

In the future, with the advent of the era of Internet of things and AI Artificial Intelligence, new technology products will bring new opportunities to the integrated circuit industry.

At present, emerging industries such as Internet of things, 5g, medical treatment, artificial intelligence and electric vehicles will become a new driving force in the industry market. The broad market space has brought new development opportunities to the packaging industry< br />

With the semiconductor industry entering the post Moore era, the packaging and testing industry has also entered the advanced packaging technology wafer level packaging (WLCSP) from the traditional packaging technology.

Although traditional packaging still plays a major role at present, with the continuous reduction of chip manufacturing process, advanced packaging will become the mainstream in the future.

Wafer level chip scale packaging (WLCSP) is a wafer packaging method. First, the whole wafer is packaged and tested, and then it is cut into each IC chip, so that the final size of the chip is the same as that of the original IC wafer.