The improvement of the utilization rate of consumer electronic products and the growth of global per capita income are important factors driving the growth of the global semiconductor packaging market.

After the epidemic spread all over the world, a large number of electronic products have instantly become necessary at home.

In terms of packaging materials, the packaging market is expected to grow at the fastest speed, mainly because of the increasing use of electronic components in various auto parts and the rapid increase in the demand for packaging in the automotive industry.

As an indispensable auxiliary material, the development of carrier products is inseparable from SMT and electronic components. In order to meet the needs of high-speed and reliable assembly of specific electronic components

Some materials with high transparency and high conductivity have been developed. The width and thickness of the carrier belt can also be customized to match the size and shape of the component.

In order to adapt to the miniaturization development trend of electronic components such as semiconductor chips, the carrier belt is also developing in the direction of small and precision. At present, the carrier belt with 4mm width has been supplied in the market.

The overall demand of the industry has increased, resulting in shortage of semiconductor chips and soft orders. With more manufacturers at the whole packaging and testing end, the position of the whole industry in the capital market will be high, and it is worth looking forward to the opportunity to attract more capital investment