Electronic packaging is an indispensable process after the production of integrated circuit chips. It is a bridge from electronic original devices to systems.

The development of packaging system is so rapid all over the world. With the Internet era and global terminal electronic products gradually moving towards multi-functional integration and low-power design,

Advanced packaging system can optimize chip performance and reduce cost through miniaturization and multi integration. The progress of packaging technology in the future will also become one of the important ways to promote the development of chip performance.

Because advanced packaging can have higher market added value than traditional packaging, a higher proportion of advanced packaging can effectively improve the profitability of the packaging and testing industry and further promote the overall valuation of relevant companies.

With smart phones, automotive electronics, 5g, AI and artificial intelligence, emerging industries put forward higher requirements for packaging. Therefore, advanced packaging has become an important development trend in the packaging field.

With the development of semiconductor industry and the increasing diversification of terminal electronic applications, the market demand for differentiated processes is also rising.