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Problems that the carrier tape may encounter in the production process

The carrier tape will encounter various problems in the production process, so they can master the speed of carrier belt production only after debugging and handling each action.

It is unwise to think that increasing the speed will increase the cost in the production process, but sometimes if the machine debugging is not enough, it may damage the mold and cause a very adverse impact on the carrier tape.

 

Therefore, we need to find the problems in production in time and see if it is the technical problems caused by your speed, so as to increase your production cost. In the case of less demanding tapes, these skilled master tapes are usually more suitable for balancing the stability of tape production.

 

The tape carrier tape is a tape carrier material cut from single-layer or three-layer high-performance polystyrene sheets (polystyrene or acrylonitrile butadiene styrene copolymer, polycarbonate, polyester, polyethylene, etc.), From material processing to computer on-line detection and control molding by advanced special equipment. From vacuum forming, detection and control stamping to CCD automatic image detection and automatic material collection, the processing technology is complete and consistent. In addition to being accurate, accurate and fast, the carrier belt can fully meet the requirements of environmental cold, heat, magnetism, ultraviolet, antistatic and environmental protection, and comply with EIA specifications.

 

The emergence of surface mount technology in the last century has brought great changes to electronic products and promoted the development of surface mount products. The original plug-in components will inevitably be replaced by patch components. At the same time, people’s demand for small-size and multi-functional electronic products such as mobile phones and computers further promotes the development of chip components to high integration and miniaturization. In addition to other transport carriers such as pallets and plastic pipes, SMD components can be used in high-speed automation on SMT machines. The required transport carrier is SMD carrier carrier tape.

 

The automatic assembly carrier of electronic components is widely used to package chip electronic components such as integrated circuits, semiconductors, quartz crystal resonators, oscillators, resistors, inductors, capacitors, connectors, light-emitting diodes, fuses, switches, relays, connectors, diodes, triodes, mobile phone shielding frames, etc. The specifications of piezoelectric crystal industry include: 49U / SMD, 49S / SMD, 49S / 5h, at-51 / SMD, UM-1 / SMD, UM-5 / SMD, smu7, OCXO, half size clock oscillator, miniaturized crystal oscillator, SMD cylindrical crystal and surface mount 8045, 7050, 6035, 5032, 4025, 3225, etc.