Thin carrier tape emerging from “surface mount technology”

Up to now, electronic components have roughly experienced three stages: classical electronic components stage, miniaturized electronic components stage and microelectronic components stage. In these three stages, the development of technology is guided by representative electronic components. Specifically:

In the first stage, the bulky electronic tube is the core and processed by manual brazing;

In the second stage, semiconductor discrete devices are mainly installed on the circuit board in the form of plug-in, and manual and automatic plug-in machines are also used for welding. Due to the limitations of components and technology, it is difficult to realize large-scale automatic production of electronic components in these two stages. Later, with the progress of technology,

The third generation of miniaturized electronic components rose rapidly, and then integrated circuits began to appear.

With the miniaturization of electronic components, advanced “surface mount technology” came into being, and quickly replaced the previous jack components. So far, the third generation microelectronic components have established the current dominant position.