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How about SMD requirements for carrying tape system

 

After the three passive components (resistance, inductance and capacitance) change from long pin to SMD, the volume continues to shrink. 0402 package has appeared now, and 0201 package will be widely used in the near future. In terms of SMT equipment, 0201 equipment has also appeared. The miniaturization of these components has driven the change of carrying tape system.

Firstly, high precision is required for the carrier belt; Secondly, the speed of taking and placing components and discrete components by SMT machine is faster and faster, and one cycle has been less than 0.09 seconds, which puts forward the requirement of high tensile strength for the carrier material; Third, the cost is reduced, and high-density packaging is required (packaging spacing is 2mm, usually 4mm); Finally, anti-static protection. Because the components are very small and easy to be adsorbed by static electricity, the SMT machine cannot get the components or the components turn sideways.– carrying tape system

 

The development process of discrete components is very similar to that of passive components, first from jack type to surface mount type, and then miniaturization. From sot223 and sod87 to the current packaging forms such as sod723 and TSLP, they have higher requirements for anti-static in addition to the same requirements as the previous three points of passive components, because these are electrostatic sensitive components.– carrying tape system