After the three passive components (resistance, inductance and capacitance) change from long pin to SMD, the volume continues to shrink. 0402 package has appeared now, and 0201 package will be widely used in the near future. In terms of SMT equipment, 0201 equipment has also appeared. The miniaturization of these components has driven the change of carrier tape system
Firstly, high precision is required for the carrier belt;
Secondly, the speed of taking and placing components and discrete components by SMT machine is faster and faster, and one cycle has been less than 0.09 seconds, which puts forward the requirement of high tensile strength for the carrier material; —carrier tape system
Third, the cost is reduced, and high-density packaging is required (packaging spacing is 2mm, usually 4mm);
Finally, anti-static protection. Because the components are very small and easy to be adsorbed by static electricity, the SMT machine cannot get the components or the components turn sideways.–carrier tape system
The development process of discrete components is very similar to that of passive components, first from jack type to surface mount type, and then miniaturization. From sot223 and sod87 to the current packaging forms such as sod723 and TSLP, they have higher requirements for anti-static in addition to the same requirements as the previous three points of passive components, because these are electrostatic sensitive components.
In the past few decades, the packaging form has undergone great changes, from dip → SOIC, TSOP, QFP, PLCC → BGA, PGA → CSP → flip chip, cob or sip. At the same time, the integration of IC is increasing. The packaged IC is from single chip to dual chip, and then to the current three and four chips. These changes are constantly meeting the requirements of smaller package volume and more functions. It can be seen from table 1 that IC changes have higher and higher requirements for carrier belt. Firstly, the reduction of feature size and the emergence of flipchip cob and sip packaging make the anti-static performance of tape carrier system more and more important; Secondly, the process of flipchip cob requires that their carrier belt must meet the requirements of the purification workshop for size and high precision. Of course, the scratch resistance of tape carrier material is also very important.—carrier tape system