The Tape Carrier Package (TCP) format is one way to meet the small outline and high leadcount interconnection needs of high performance microprocessors.

The TCP has been designed to offerreduced pitch, thin package profiles, smaller footprint on the printed circuit board, without compromising performance. Intel continues to provide packaging solutions which meet rigorouscriteria for quality and performance.

The Tape Carrier Package is no exception. Key package features include surface mount technology design, lead pitch of 0.25 mm, 48 mm tape format,polyimide-up for pick and place, and slide carrier handling. Shipped flat in slide carriers, the leads

are designed to be formed into a “gull-wing” configuration and reflowed onto the PCB by one of several methods. Intel has done extensive optimization of the hot bar reflow process and suggestions for that process are included in this chapter. Satisfactory placement and reworkcapability has been demonstrated by industry sources using the hot gas reflow process.

Industry data also exists which demonstrates process feasibility for laser reflow.—From News