The TCP family has been characterized for thermal, electrical, and mechanical performance.

Component and system level thermal testing has shown the TCP package to be capable of meeting system level thermal design needs. Additional potential board level enhancements have been identified and characterized to provide the most flexible design choices. A full suite of component

and board level stress testing has been completed to ensure that the component meets Intel’s

reliability targets. Evaluations of solder joints by stress testing, lead stiffness studies, and finite

element modeling have demonstrated that the mounted component will meet field use conditions

and lifetimes. The TCP package is capable of meeting a wide variety of design and use

applications. Table 12-1 provides an overview of TCP package attributes