- 18
- May
SURFTAPE Supporting semiconductor industry packaging standards: EIA 48, IEC 60286-3, JIS C0806.
China factory manufacture of the CARRIR TAPE COVER TAPE
No tooling cost or large minimum order costs
Ideal for bare die, chip scale packages, MEMs, LEDs, and micro thin components. Devices are held safely in place – preventing corners, edges and surfaces from contacting the packing material
Wafer film base secures the devices in the exact position they are placed, no theta correction is required
One tape size can fit a multitude of component sizes